Silicon wafers are the main production materials in the semiconductor and photovoltaic fields. The silicon multi-wire cutting technology is currently the most advanced wafer processing technology in the world. It is different from traditional cutting methods such as saw blades and grinding wheels. It is also different from advanced laser cutting and internal circular cutting. Its principle is through A high-speed moving steel wire drives the cutting blade attached to the wire to rub the silicon rod to achieve a cutting effect. Throughout the entire process, the steel wire guides through more than a dozen wire wheels, forming a wire mesh on the main roll, and the workpiece to be machined is fed through the worktable to achieve workpiece feed. Compared with other technologies, silicon multi-wire cutting technology has the advantages of high efficiency, high productivity, and high precision. Is currently the most widely used silicon cutting technology.
Multi-wire cutting technology is a landmark innovation in the silicon processing industry and the solar photovoltaic industry. It replaces the original internal-circular cutting equipment. The sliced ​​wafers have a degree of bow (BOW) and warpage compared to the internal slicing process ( WARP is small, TAPER is good, total thickness tolerance (TTA) is small, cutting edge loss is small, surface damage is shallow, wafer surface roughness is small and many other advantages.
The linear cutting mechanism of solar wafers is that the machine guide wheel drives the steel wire during high-speed operation, so that the mortar mixed with polyethylene glycol and silicon carbide powder is sent to the cutting zone by the steel wire, in the high-speed operation and pressure online of the steel wire. The workpiece continuously rubs to complete the cutting process.
During the entire cutting process, the main effects on the quality and yield of silicon wafers are the viscosity of the cutting fluid, the particle size and particle size of the silicon carbide powder, the viscosity of the mortar, the flow of the mortar, the speed of the steel wire, and the tension of the steel wire. And the workpiece feed rate.
First, the viscosity of cutting fluid (PEG)
Since the silicon carbide powder is suspended on the cutting fluid and cut through the steel wire during the entire cutting process, the cutting fluid mainly plays a role of suspension and cooling.
1. The viscosity of cutting fluid is an important guarantee for the suspension of silicon carbide powder. Due to the different system thinking of different machine development and design, the viscosity of the mortar is also different, that is, the viscosity of the cutting fluid is also different. Swiss wire cutters, for example, require cutting fluids with a viscosity of no less than 55, while NTC requires 22-25, and Ernst as low as 18. Only the viscosity of the cutting standard that meets the requirements of the machine can guarantee the uniform suspension distribution of the silicon carbide micropowder during the cutting process and the mortar can enter the cutting zone steadily through the mortar pipe with the steel wire.
2. Since the steel wire with mortar in the process of cutting the silicon material will undergo high temperature due to friction, the viscosity of the cutting fluid plays an important role in cooling. If the viscosity is not up to standard, the fluidity of the liquid will be poor, and the temperature can not be lowered to cause burns or breakage. Therefore, the viscosity of the cutting fluid ensures the temperature control of the entire process.
Second, the silicon carbide powder size and size
The cutting of solar wafers is actually the cutting of steel wire with silicon carbide powder, so the particle size and particle size of the fine powder are the key to the smoothness and cutting ability of the silicon wafer. The laser scribing machine and the grain type rule, the cut-out silicon wafers show good smoothness; uniform particle size distribution will improve the cutting ability of the silicon wafers.
Third, the viscosity of mortar
The ability of the wire saw to cut wafers has an inseparable relationship with the viscosity of the mortar. The viscosity of the mortar depends on the viscosity of the cutting fluid of the silicon wafer laser scribing machine, the adaptability of the silicon wafer cutting fluid and the silicon carbide micropowder, the proportion of the silicon wafer cutting fluid and the silicon carbide micropowder, and the density of the mortar. Only the viscosity of the mortar that meets the requirements of the machine (such as NTC machine requirements about 250) can improve the cutting efficiency and improve the yield in the cutting process.
Multi-wire cutting technology is a landmark innovation in the silicon processing industry and the solar photovoltaic industry. It replaces the original internal-circular cutting equipment. The sliced ​​wafers have a degree of bow (BOW) and warpage compared to the internal slicing process ( WARP is small, TAPER is good, total thickness tolerance (TTA) is small, cutting edge loss is small, surface damage is shallow, wafer surface roughness is small and many other advantages.
The linear cutting mechanism of solar wafers is that the machine guide wheel drives the steel wire during high-speed operation, so that the mortar mixed with polyethylene glycol and silicon carbide powder is sent to the cutting zone by the steel wire, in the high-speed operation and pressure online of the steel wire. The workpiece continuously rubs to complete the cutting process.
During the entire cutting process, the main effects on the quality and yield of silicon wafers are the viscosity of the cutting fluid, the particle size and particle size of the silicon carbide powder, the viscosity of the mortar, the flow of the mortar, the speed of the steel wire, and the tension of the steel wire. And the workpiece feed rate.
First, the viscosity of cutting fluid (PEG)
Since the silicon carbide powder is suspended on the cutting fluid and cut through the steel wire during the entire cutting process, the cutting fluid mainly plays a role of suspension and cooling.
1. The viscosity of cutting fluid is an important guarantee for the suspension of silicon carbide powder. Due to the different system thinking of different machine development and design, the viscosity of the mortar is also different, that is, the viscosity of the cutting fluid is also different. Swiss wire cutters, for example, require cutting fluids with a viscosity of no less than 55, while NTC requires 22-25, and Ernst as low as 18. Only the viscosity of the cutting standard that meets the requirements of the machine can guarantee the uniform suspension distribution of the silicon carbide micropowder during the cutting process and the mortar can enter the cutting zone steadily through the mortar pipe with the steel wire.
2. Since the steel wire with mortar in the process of cutting the silicon material will undergo high temperature due to friction, the viscosity of the cutting fluid plays an important role in cooling. If the viscosity is not up to standard, the fluidity of the liquid will be poor, and the temperature can not be lowered to cause burns or breakage. Therefore, the viscosity of the cutting fluid ensures the temperature control of the entire process.
Second, the silicon carbide powder size and size
The cutting of solar wafers is actually the cutting of steel wire with silicon carbide powder, so the particle size and particle size of the fine powder are the key to the smoothness and cutting ability of the silicon wafer. The laser scribing machine and the grain type rule, the cut-out silicon wafers show good smoothness; uniform particle size distribution will improve the cutting ability of the silicon wafers.
Third, the viscosity of mortar
The ability of the wire saw to cut wafers has an inseparable relationship with the viscosity of the mortar. The viscosity of the mortar depends on the viscosity of the cutting fluid of the silicon wafer laser scribing machine, the adaptability of the silicon wafer cutting fluid and the silicon carbide micropowder, the proportion of the silicon wafer cutting fluid and the silicon carbide micropowder, and the density of the mortar. Only the viscosity of the mortar that meets the requirements of the machine (such as NTC machine requirements about 250) can improve the cutting efficiency and improve the yield in the cutting process.
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